What is EN 60851-3:2012?

EN 60851-3:2012 is an international standard that specifies the test methods for determining the electrical, mechanical, and thermal properties of solderable solderless wrapped connections. These connections are used in electronic components and provide a reliable means of joining conductors.

Electrical Properties Test Methods

The standard outlines several test methods to assess the electrical properties of soldered connections. One such method is the measurement of contact resistance using a low-resistance ohmmeter. This test helps ensure that the connection has low electrical resistance, minimizing power loss and maximizing efficiency. Another method involves examining insulation resistance to determine if there are any leakage paths that could compromise the functionality of the connection.

Mechanical Properties Test Methods

To evaluate the mechanical integrity of solderable solderless wrapped connections, EN 60851-3:2012 provides guidelines for conducting various tests. One such test involves subjecting the connection to tensile stress, measuring its ability to withstand pulling forces without failure. Additionally, the standard defines procedures for assessing the connection's resistance to repeated bending and vibration, which are common in real-world applications. These tests ensure that the connection remains stable and durable under typical operating conditions.

Thermal Properties Test Methods

Soldered connections are often subjected to temperature variations during operation. Therefore, it is crucial to evaluate their performance under different thermal conditions. EN 60851-3:2012 includes methods for testing the connections' resistance to high temperatures, rapid temperature changes, and cyclic temperature exposure. By subjecting the connections to extreme thermal conditions, designers and manufacturers can ensure their reliability and longevity.

In conclusion, EN 60851-3:2012 is an essential standard that provides test methods for evaluating the electrical, mechanical, and thermal properties of solderable solderless wrapped connections. By adhering to these standards, engineers and manufacturers can produce reliable electronic components with robust connections, ensuring optimal performance and longevity in various applications.